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Apparent thermal conductivity of periodic two-dimensional composites

Author
JIANG, M1 ; JASIUK, I2 ; OSTOJA-STARZEWSKI, M3
[1] GE Global Research Center, I Research Circle, Building KW, Rm. C1610J, Niskayuna, NY 12309, United States
[2] The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405, United States
[3] Department of Mechanical Engineering, McGill University, 817 Sherbrooke Street West, Montréal, Que., H3A 2K6, Canada
Source

Computational materials science. 2002, Vol 25, Num 3, pp 329-338 ; ref : 12 ref

ISSN
0927-0256
Scientific domain
Condensed state physics
Publisher
Elsevier Science, Amsterdam
Publication country
Netherlands
Document type
Article
Language
English
Keyword (fr)
Condition aux limites Conductivité thermique Etude théorique Matériau composite Modèle 2 dimensions Méthode numérique Phénomène interface Réseau carré
Keyword (en)
Boundary conditions Thermal conductivity Theoretical study Composite materials Two dimensional model Numerical method Interface phenomena Square lattices
Keyword (es)
Modelo 2 dimensiones Método numérico
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60F Transport properties of condensed matter (nonelectronic) / 001B60F70 Nonelectronic thermal conduction and heat-pulse propagation in solids; thermal waves

Pacs
6670 Nonelectronic thermal conduction and heat-pulse propagation in solids; thermal waves

Discipline
Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
14190734

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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