A study of polyamide-imide resin/copper foil composite materials
- Author
- SHEN CHOU1 ; LEE, Ker-Sen1
[1] Graduate School of Fibre and Polymer Engineering, National Taiwan University of Science and Technology 43, Keelung Road, Section 4, Taipei, 10672, Taiwan, Province of China - Source
Polymers & polymer composites. 2003, Vol 11, Num 1, pp 57-67, 11 p ; ref : 13 ref
- ISSN
- 0967-3911
- Scientific domain
- Polymers, paint and wood industries
- Publisher
- Rapra Technology, Shrewsbury
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Adhésivité Amide polymère Amidoimide polymère Constante diélectrique Cuivre Etherimide polymère Etude expérimentale Matériau composite Polycondensation Polymère aromatique Résistance chaleur Résistance chimique Résistance pelage Stratifié Propriété surface Propriété électrique
- Keyword (en)
- Adhesivity Nylon Amidoimide polymer Permittivity Copper Etherimide polymer Experimental study Composite material Condensation polymerization Aromatic polymer Heat resistance Chemical resistance Peel strength Laminate Surface properties Electrical properties
- Keyword (es)
- Adhesividad Amida polímero Amidoimida polímero Constante dieléctrica Cobre Eterimida polímero Estudio experimental Material compuesto Policondensación Polímero aromático Resistencia calor Resistencia química Resistencia pelado Estratificado Propiedad superficie Propiedad eléctrica
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A06 Forms of application and semi-finished materials / 001D10A06I Laminates
- Discipline
- Polymer industry, paints, wood
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 14491384
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1177/096739110301100107 
https://dx.doi.org/10.1177/096739110301100107
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