A study of the properties of PMR polyimide resin/copper foil composites
- Author
- SHEN CHOU1 ; LEE, Ker-Sen1
[1] Graduate School of Fiber and Polymer Engineering, National Taiwan University of Science and Technology, 43, Keelung Road, Section 4, Taipei, 10672, Taiwan, Province of China - Source
Polymers & polymer composites. 2003, Vol 11, Num 4, pp 327-339, 13 p ; ref : 11 ref
- ISSN
- 0967-3911
- Scientific domain
- Polymers, paint and wood industries
- Publisher
- Rapra Technology, Shrewsbury
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Cuivre Etude expérimentale Feuille métallique Fraction vide Imide polymère Polymère aromatique Polymère réticulé Propriété diélectrique Propriété mécanique Résistance chimique Résistance eau Résistance humidité Stratifié métal plastique Bisnadimide résine
- Keyword (en)
- Copper Experimental study Metal foil Void fraction Polyimide Aromatic polymer Crosslinked polymer Dielectric properties Mechanical properties Chemical resistance Waterproofness Humidity resistance Metal plastic laminate
- Keyword (es)
- Cobre Estudio experimental Hoja metálica Fracción vacío Imida polímero Polímero aromático Polímero reticulado Propiedad dieléctrica Propiedad mecánica Resistencia química Impermeabilidad agua Resistencia a la humedad Estratificado metal plástico
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A06 Forms of application and semi-finished materials / 001D10A06I Laminates
- Discipline
- Polymer industry, paints, wood
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 14793628
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1177/096739110301100408 
https://dx.doi.org/10.1177/096739110301100408
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