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A novel mathematical procedure to evaluate the effects of surface topography on the interfacial state of stress. Part II. Verification of the method for scarf interfaces

Author
WEIJIAN MA1 ; GOMATAM, Rajesh2 ; SANCAKTAR, Erol2
[1] Department of Mechanical and Aeronautical Engineering, Clarkson University, Potsdam, NY 13699, United States
[2] Department of Polymer Engineering, The University of Akron, Akron, OH 44325-0301, United States
Source

Journal of adhesion science and technology. 2003, Vol 17, Num 6, pp 831-846, 16 p ; ref : 9 ref

CODEN
JATEE8
ISSN
0169-4243
Scientific domain
Polymers, paint and wood industries
Publisher
Brill, Leiden
Publication country
Netherlands
Document type
Article
Language
English
Author keyword
3D stress distributions Bi-material interfaces adhesive joints elasticity finite element analysis interfacial stresses mechanical adhesion scarf joints surface preparation surface topography
Keyword (fr)
Aluminium Assemblage collé Assemblage à onglet Contrainte cisaillement Distribution contrainte Effet surface Epoxyde résine Etude théorique Modélisation Méthode élément fini Topographie surface Interface métal polymère
Keyword (en)
Aluminium Adhesive joint Scarf joint Shear stress Stress distribution Surface effect Epoxy resin Theoretical study Modeling Finite element method Surface topography
Keyword (es)
Aluminio Ensambladura pegada Junta biselada Tensión cizallamiento Campo restricción Efecto superficie Epóxido resina Estudio teórico Modelización Método elemento finito
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A06 Forms of application and semi-finished materials / 001D10A06K Miscellaneous

Discipline
Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
14882300

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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