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Comparative TEM study of bonded silicon/silicon interfaces fabricated by hydrophilic, hydrophobic and UHV wafer bonding

Author
REZNICEK, A1 ; SCHOLZ, R1 ; SENZ, S1 ; GÖSELE, U1
[1] Max Planck Institute of Microstructure Physics, Weinberg 2, 06120 Halle, Germany
Conference title
EMC 2002: XIth International Conference on Electron Microscopy of Solids, May 19-23, 2002 in Krynica, Poland
Conference name
EMC 2002 International Conference on Electron Microscopy of Solids (11 ; Krynica 2002-05-19)
Author (monograph)
BIELANSKA, Elzbieta (Editor)1 ; DUTKIEWICZ, Jan (Editor)1 ; ZIEBA, Pawel (Editor)1
Polish Materials Society ; State Committee for Scientific Research, Poland (Funder/Sponsor)
Polish Academy of Sciences ; Committee on Materials Science ; Microscopy Section, Poland (Funder/Sponsor)
[1] Polish Academy of Sciences, Institute of Metallurgy and Materials Science, Cracow, Poland
Source

Materials chemistry and physics. 2003, Vol 81, Num 2-3, pp 277-280, 4 p ; ref : 6 ref

CODEN
MCHPDR
ISSN
0254-0584
Scientific domain
Chemistry; Metallurgy, welding; Physics
Publisher
Elsevier, Lausanne
Publication country
Switzerland
Document type
Conference Paper
Language
English
Keyword (fr)
Etude comparative Fixation pastille Interface Microscopie électronique transmission Microscopie électronique Silicium
Keyword (en)
Comparative study Wafer bonding Interfaces Transmission electron microscopy Electron microscopy Silicon
Keyword (es)
Estudio comparativo
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60A Structure of solids and liquids; crystallography / 001B60A16 Electron, ion, and scanning probe microscopy

Discipline
Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
15085340

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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