High-density 3-D microsystem-in-package technology and its application for integrated CCD micro-camera visual inspection system
- Author
- YAMADA, Hiroshi1 ; TOGASAKI, Takashi2 ; SADAMOTO, Atsushi1 ; SUDO, Hajime1
[1] Corporate Research & Development Center, Toshiba Corporation, 1, Komukai Toshiba-cho, Saiwai-ku, Kawasaki, Kanagawa 212-8582, Japan
[2] Corporate Manufacturing Engineering Center, Toshiba Corporation 33, Shin-isogo-cho, Isogo-ku, Yokohama, Kanagawa 235-0017, Japan - Conference title
- Dielectrics for nanosystems : materials science, processing, reliability, and manufacturing (Honolulu HI, 3-8 October 2004)
- Conference name
- Dielectrics for nanosystems : materials science, processing, reliability, and manufacturing. International symposium (1 ; Honolulu HI 2004-10-03)
- Author (monograph)
- Singh, R (Editor); Iwai, H (Editor); Tummala, R.R (Editor); Sun, S.C (Editor)
Electrochemical Society, Dielectric Science Division, Pennington NJ, United States (Organiser of meeting)
Electrochemical Society, Technology Division, Pennington NJ, United States (Organiser of meeting)
Electrochemical Society, Electronics Division, Pennington NJ, United States (Organiser of meeting) - Source
Proceedings - Electrochemical Society. 2004, pp 277-291, 15 p ; ref : 32 ref
- ISSN
- 0161-6374
- ISBN
- 1-56677-417-9
- Scientific domain
- General chemistry, physical chemistry; Electronics; Electrical engineering; Energy; Physics
- Publisher
- Electrochemical Society, Pennington NJ
- Publication country
- United States
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Caméra CCD Circuit intégré Composant optique Contrôle visuel Densité élevée Dispositif CCD Dispositif électromécanique Imagerie CCD Interconnexion Micromachine Packaging électronique Transmission donnée
- Keyword (en)
- CCD camera Integrated circuit Optical component Visual control High density Charge coupled device Electromechanical device CCD imaging Interconnection Micromachine Electronic packaging Data transmission
- Keyword (es)
- Cámara CCD Circuito integrado Componente óptico Control visual Densidad elevada Dispositivo carga acoplada Dispositivo electromecánico Imagenería CCD Interconexión Micromáquina Packaging electrónico Transmisión datos
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F07 Charge transfer devices
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F16 Imaging devices
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 16545661
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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