Influence of thermal contact resistance on thermal impedance of microelectronic structures
- Author
- VERMEERSCH, B1 ; DE MEY, G1
[1] Ghent University, Department of Electronics and Information Systems (ELIS), Sint Pietersnieuwstraat 41, 9000 Gent, Belgium - Source
Microelectronics and reliability. 2007, Vol 47, Num 8, pp 1233-1238, 6 p ; ref : 13 ref
- CODEN
- MCRLAS
- ISSN
- 0026-2714
- Scientific domain
- Electronics
- Publisher
- Elsevier, Oxford
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Assemblage collé Contact thermique Céramique Haute fréquence Impédance Microélectronique Modélisation Packaging électronique Résistance thermique contact Résistance thermique
- Keyword (en)
- Adhesive joint Thermal contact Ceramic materials High frequency Impedance Microelectronics Modeling Electronic packaging Contact thermal resistance Thermal resistance
- Keyword (es)
- Ensambladura pegada Contacto térmico Cerámica Alta frecuencia Impedancia Microelectrónica Modelización Packaging electrónico Resistencia térmica contacto Resistencia térmica
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 18980936
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.microrel.2006.09.020 
https://dx.doi.org/10.1016/j.microrel.2006.09.020
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