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Development of LVL frame structures using glued metal plate joints I : bond quality and joint performance of LVL-metal joints using epoxy resins

Author
PIRVU, C1 ; YOSHIDA, H1 ; TAKI, K1
[1] Department of Forest Resources, Faculty of Agriculture, Shizuoka University, 836 Ohya, Shizuoka 422-8529, Japan
Source

Journal of wood science. 1999, Vol 45, Num 4, pp 284-290 ; ref : 12 ref

Scientific domain
Forestry, silviculture; Polymers, paint and wood industries
Publisher
Springer, Tokyo
Publication country
Japan
Document type
Article
Language
English
Keyword (fr)
Bois construction Collage Construction bois Epoxyde résine Essai adhérence Evaluation performance Joint construction Métal Plaque Qualité Résistance cisaillement Résultat expérimental
Keyword (en)
Lumber Adhesive bonding Wood construction Epoxy resin Adhesion test Performance evaluation Construction joint Metal Plate Quality Shear strength Experimental result
Keyword (es)
Madera construcción Enlace adhesivo Construcción madera Epóxido resina Ensayo adherencia Evaluación prestación Junta construcción Metal Placa Calidad Resistencia cizallamiento Resultado experimental
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D14 Buildings. Public works / 001D14H Construction (buildings and works) / 001D14H02 Building structure / 001D14H02B Wood structure

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D14 Buildings. Public works / 001D14I Buildings / 001D14I02 Building technical equipments / 001D14I02C Electrical equipment

Discipline
Building. Public works. Transport. Civil engineering
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
2004842

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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