Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfaces
- Author
- XU, R. L1 ; LIU, Y. C1 ; WEI, C1 ; YU, L. M1
[1] Tianjin Key Laboratory of Advanced Jointing Technology, School of Materials Science and Engineering, Tianjin University, Tianjin, China - Source
Soldering & surface mount technology. 2010, Vol 22, Num 2, pp 13-20, 8 p ; ref : 3/4 p
- ISSN
- 0954-0911
- Scientific domain
- Electronics
- Publisher
- Emerald, Bradford
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Alliage eutectique Assemblage brasage tendre Assemblage circuit intégré Brasage sans plomb Composé intermétallique Fiabilité Matériau fragile Métal fondu brasage tendre Structure interface
- Keyword (en)
- Eutectic alloy Soldered joint Integrated circuit bonding Lead free soldering Intermetallic compound Reliability Brittle material Solder metal Interface structure
- Keyword (es)
- Aleación eutéctica Junta soldada Soldeo sin plomo Compuesto intermetálico Fiabilidad Material frágil Metal fundido soldeo blando Estructura interfaz
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 22769657
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1108/09540911011036244 
https://dx.doi.org/10.1108/09540911011036244
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