Structure-dependent behavior of stress-induced voiding in Cu interconnects
- Author
- WU, Zhen-Yu1 ; YANG, Yin-Tang1 ; CHAI, Chang-Chun1 ; LI, Yue-Jin1 ; WANG, Jia-You1 ; BIN LI1 ; JING LIU1
[1] Key Laboratory of Ministry of Education for Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an 710071, China - Source
Thin solid films. 2010, Vol 518, Num 14, pp 3778-3781, 4 p ; ref : 20 ref
- CODEN
- THSFAP
- ISSN
- 0040-6090
- Scientific domain
- Crystallography; Metallurgy, welding; Condensed state physics
- Publisher
- Elsevier, Amsterdam
- Publication country
- Netherlands
- Document type
- Article
- Language
- English
- Author keyword
- Interconnect Reliability Stress-induced voiding
- Keyword (fr)
- Analyse dommage Cavité dans réseau Contrainte traction Coupe transversale Cuivre Diffusion(transport) Défaut cristallin Effet contrainte Etude théorique Faisceau ion Fiabilité Lacune Modélisation Potentiel chimique Section efficace 6172Q 6835F
- Keyword (en)
- Failure analysis Voids Tensile stress Cross section Copper Diffusion Crystal defects Stress effects Theoretical study Ion beams Reliability Vacancies Modelling Chemical potential Cross sections
- Keyword (es)
- Tensión traccíon Corte transverso
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60A Structure of solids and liquids; crystallography / 001B60A72 Defects and impurities in crystals; microstructure / 001B60A72Q Microscopic defects (voids, inclusions, etc.)
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H35 Solid surfaces and solid-solid interfaces / 001B60H35F Diffusion; interface formation
- Discipline
- Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 22769862
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.tsf.2009.12.093 
https://dx.doi.org/10.1016/j.tsf.2009.12.093
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