A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset
- Author
- SONG SHI1 2 ; MING YANG3 ; ZHENHUA LUO3 ; WEIJIAN HAN3 ; JIDONG HU2 ; TONG ZHAO3 ; DAHAI ZHANG1 2
[1] Tianjin Polytechnic University, Tianjin 300160, China
[2] National Key Laboratory of Advanced Functional Composite Materials ,Aerospace Reserch Institute of Materials & Processing Technology, Beijing 100076, China
[3] Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China - Source
Polymers & polymer composites. 2011, Vol 19, Num 2-3, pp 141-147, 7 p ; ref : 15 ref
- ISSN
- 0967-3911
- Scientific domain
- Polymers, paint and wood industries
- Publisher
- Rapra, Shrewsbury
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Composé polyynique Durcissement (matière plastique) Effet température Etude expérimentale Polycondensation Polymère conducteur Polymère conjugué Propriété thermique Préparation Silane copolymère Stabilité thermique Structure moléculaire Thermodurcissable
- Keyword (en)
- Polyynic compound Curing (plastics) Temperature effect Experimental study Condensation polymerization Conducting polymers Conjugated polymer Thermal properties Preparation Silane copolymer Thermal stability Molecular structure Thermosetting resin
- Keyword (es)
- Compuesto poliínico Endurecimiento (material plástico) Efecto temperatura Estudio experimental Policondensación Polímero conjugado Propiedad térmica Preparación Silano copolímero Estabilidad térmica Estructura molecular Termoestable
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D09 Physicochemistry of polymers / 001D09E Inorganic and organomineral polymers / 001D09E01 Preparation
- Discipline
- Physical chemistry of polymers
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 24009618
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Access to the document
Install on your browser
DOI
10.1177/0967391111019002-314 
https://dx.doi.org/10.1177/0967391111019002-314
"O:13:\"PanistOpenUrl\":36:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000idc\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:28:\"10.1177\/0967391111019002-314\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:73:\"A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset\";s:9:\"\u0000*\u0000jtitle\";s:29:\"Polymers & polymer composites\";s:9:\"\u0000*\u0000stitle\";s:20:\"Polym. polym. compos\";s:7:\"\u0000*\u0000date\";s:4:\"2011\";s:9:\"\u0000*\u0000volume\";s:2:\"19\";s:8:\"\u0000*\u0000issue\";s:3:\"2-3\";s:8:\"\u0000*\u0000spage\";s:3:\"141\";s:8:\"\u0000*\u0000epage\";s:3:\"147\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"0967-3911\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"SONG SHI\";s:10:\"\u0000*\u0000aufirst\";s:0:\"\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:6:{i:0;s:9:\"MING YANG\";i:1;s:11:\"ZHENHUA LUO\";i:2;s:11:\"WEIJIAN HAN\";i:3;s:9:\"JIDONG HU\";i:4;s:9:\"TONG ZHAO\";i:5;s:11:\"DAHAI ZHANG\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:73:\"A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset\";s:8:\"\u0000*\u0000place\";s:10:\"Shrewsbury\";s:6:\"\u0000*\u0000pub\";s:5:\"Rapra\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"7\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Panist access
"O:12:\"IstexOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:28:\"10.1177\/0967391111019002-314\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:73:\"A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset\";s:9:\"\u0000*\u0000jtitle\";s:29:\"Polymers & polymer composites\";s:9:\"\u0000*\u0000stitle\";s:20:\"Polym. polym. compos\";s:7:\"\u0000*\u0000date\";s:4:\"2011\";s:9:\"\u0000*\u0000volume\";s:2:\"19\";s:8:\"\u0000*\u0000issue\";s:3:\"2-3\";s:8:\"\u0000*\u0000spage\";s:3:\"141\";s:8:\"\u0000*\u0000epage\";s:3:\"147\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"0967-3911\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"SONG SHI\";s:10:\"\u0000*\u0000aufirst\";s:0:\"\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:6:{i:0;s:9:\"MING YANG\";i:1;s:11:\"ZHENHUA LUO\";i:2;s:11:\"WEIJIAN HAN\";i:3;s:9:\"JIDONG HU\";i:4;s:9:\"TONG ZHAO\";i:5;s:11:\"DAHAI ZHANG\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:73:\"A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset\";s:8:\"\u0000*\u0000place\";s:10:\"Shrewsbury\";s:6:\"\u0000*\u0000pub\";s:5:\"Rapra\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"7\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Istex access
"O:16:\"UnpaywallOpenUrl\":35:{s:8:\"\u0000*\u0000email\";s:27:\"assistance-portail@inist.fr\";s:6:\"\u0000*\u0000fmt\";N;s:6:\"\u0000*\u0000doi\";s:28:\"10.1177\/0967391111019002-314\";s:6:\"\u0000*\u0000pii\";N;s:7:\"\u0000*\u0000pmid\";N;s:9:\"\u0000*\u0000atitle\";N;s:9:\"\u0000*\u0000jtitle\";N;s:9:\"\u0000*\u0000stitle\";N;s:7:\"\u0000*\u0000date\";N;s:9:\"\u0000*\u0000volume\";N;s:8:\"\u0000*\u0000issue\";N;s:8:\"\u0000*\u0000spage\";N;s:8:\"\u0000*\u0000epage\";N;s:8:\"\u0000*\u0000pages\";N;s:7:\"\u0000*\u0000issn\";N;s:8:\"\u0000*\u0000eissn\";N;s:9:\"\u0000*\u0000aulast\";N;s:10:\"\u0000*\u0000aufirst\";N;s:9:\"\u0000*\u0000auinit\";N;s:10:\"\u0000*\u0000auinitm\";N;s:5:\"\u0000*\u0000au\";N;s:9:\"\u0000*\u0000aucorp\";N;s:7:\"\u0000*\u0000isbn\";N;s:8:\"\u0000*\u0000coden\";N;s:8:\"\u0000*\u0000genre\";N;s:7:\"\u0000*\u0000part\";N;s:9:\"\u0000*\u0000btitle\";N;s:8:\"\u0000*\u0000title\";N;s:8:\"\u0000*\u0000place\";N;s:6:\"\u0000*\u0000pub\";N;s:10:\"\u0000*\u0000edition\";N;s:9:\"\u0000*\u0000tpages\";N;s:9:\"\u0000*\u0000series\";N;s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";N;}"
Unpaywall access
"O:16:\"EuropePMCOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:28:\"10.1177\/0967391111019002-314\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:73:\"A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset\";s:9:\"\u0000*\u0000jtitle\";s:29:\"Polymers & polymer composites\";s:9:\"\u0000*\u0000stitle\";s:20:\"Polym. polym. compos\";s:7:\"\u0000*\u0000date\";s:4:\"2011\";s:9:\"\u0000*\u0000volume\";s:2:\"19\";s:8:\"\u0000*\u0000issue\";s:3:\"2-3\";s:8:\"\u0000*\u0000spage\";s:3:\"141\";s:8:\"\u0000*\u0000epage\";s:3:\"147\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"0967-3911\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"SONG SHI\";s:10:\"\u0000*\u0000aufirst\";s:0:\"\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:6:{i:0;s:9:\"MING YANG\";i:1;s:11:\"ZHENHUA LUO\";i:2;s:11:\"WEIJIAN HAN\";i:3;s:9:\"JIDONG HU\";i:4;s:9:\"TONG ZHAO\";i:5;s:11:\"DAHAI ZHANG\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:73:\"A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset\";s:8:\"\u0000*\u0000place\";s:10:\"Shrewsbury\";s:6:\"\u0000*\u0000pub\";s:5:\"Rapra\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"7\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Europe PubMed Central access
"O:11:\"BaseOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:28:\"10.1177\/0967391111019002-314\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:73:\"A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset\";s:9:\"\u0000*\u0000jtitle\";s:29:\"Polymers & polymer composites\";s:9:\"\u0000*\u0000stitle\";s:20:\"Polym. polym. compos\";s:7:\"\u0000*\u0000date\";s:4:\"2011\";s:9:\"\u0000*\u0000volume\";s:2:\"19\";s:8:\"\u0000*\u0000issue\";s:3:\"2-3\";s:8:\"\u0000*\u0000spage\";s:3:\"141\";s:8:\"\u0000*\u0000epage\";s:3:\"147\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"0967-3911\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"SONG SHI\";s:10:\"\u0000*\u0000aufirst\";s:0:\"\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:6:{i:0;s:9:\"MING YANG\";i:1;s:11:\"ZHENHUA LUO\";i:2;s:11:\"WEIJIAN HAN\";i:3;s:9:\"JIDONG HU\";i:4;s:9:\"TONG ZHAO\";i:5;s:11:\"DAHAI ZHANG\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:73:\"A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset\";s:8:\"\u0000*\u0000place\";s:10:\"Shrewsbury\";s:6:\"\u0000*\u0000pub\";s:5:\"Rapra\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"7\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Base Search access
"O:12:\"ArXivOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:28:\"10.1177\/0967391111019002-314\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:73:\"A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset\";s:9:\"\u0000*\u0000jtitle\";s:29:\"Polymers & polymer composites\";s:9:\"\u0000*\u0000stitle\";s:20:\"Polym. polym. compos\";s:7:\"\u0000*\u0000date\";s:4:\"2011\";s:9:\"\u0000*\u0000volume\";s:2:\"19\";s:8:\"\u0000*\u0000issue\";s:3:\"2-3\";s:8:\"\u0000*\u0000spage\";s:3:\"141\";s:8:\"\u0000*\u0000epage\";s:3:\"147\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"0967-3911\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"SONG SHI\";s:10:\"\u0000*\u0000aufirst\";s:0:\"\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:6:{i:0;s:9:\"MING YANG\";i:1;s:11:\"ZHENHUA LUO\";i:2;s:11:\"WEIJIAN HAN\";i:3;s:9:\"JIDONG HU\";i:4;s:9:\"TONG ZHAO\";i:5;s:11:\"DAHAI ZHANG\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:73:\"A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset\";s:8:\"\u0000*\u0000place\";s:10:\"Shrewsbury\";s:6:\"\u0000*\u0000pub\";s:5:\"Rapra\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"7\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
arXiv access
