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Building materials thermal conductivity measurement and correlation with heat flow meter, laser flash analysis and TCi

Author
CHA, Junghoon1 ; SEO, Jungki1 ; KIM, Sumin1
[1] Building Environment and Materials Lab, School of Architecture, Soongsil University, Seoul, Korea, Republic of
Source

Journal of thermal analysis and calorimetry. 2012, Vol 109, Num 1, pp 295-300, 6 p ; ref : 8 ref

ISSN
1388-6150
Scientific domain
General chemistry, physical chemistry
Publisher
Springer, Dordrecht
Publication country
Netherlands
Document type
Article
Language
English
Author keyword
Decrease energy consumption HFM LFA TCi Thermal conductivity
Keyword (fr)
Conductivité thermique Consommation énergie Corrélation Epoxyde résine Flux thermique Matériau construction Mesure conductivité thermique Mur Plancher Propriété thermique Analyse laser flash
Keyword (en)
Thermal conductivity Energy consumption Correlation Epoxy resin Heat flow Construction materials Thermal conductivity measurement Building wall Floor Thermal properties Laser flash analysis
Keyword (es)
Conductividad térmica Consumo energía Correlación Epóxido resina Flujo térmico Material construcción Muro Piso Propiedad térmica
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A08 Application fields

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D14 Buildings. Public works / 001D14I Buildings / 001D14I01 External envelopes / 001D14I01F Building insulation / 001D14I01F3 Thermal insulation

Discipline
Building. Public works. Transport. Civil engineering Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
26011376

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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