The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers : WaferBond'11, International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration
- Author
- MASTEIKA, V1 ; KOWAL, J1 ; BRAITWAITE, N. St. J1 ; ROGERS, T2
[1] The Open University, Milton Keynes MK7 6AA, United Kingdom
[2] Applied Microengineering Limited, Unit 8, Library Avenue Harwell Campus, Didcot, Oxfordshire OX11 0SG, United Kingdom - Source
Microsystem technologies. 2013, Vol 19, Num 5, pp 705-712, 8 p ; ref : 1/4 p
- ISSN
- 0946-7076
- Scientific domain
- Electronics; Mechanical engineering; Metrology and instrumentation
- Publisher
- Springer, Heidelberg
- Publication country
- Germany
- Document type
- Article
- Language
- English
- Keyword (fr)
- Atmosphère contrôlée Charge statique Etude expérimentale Etude théorique Fissure Fixation pastille Humidité relative Interface Longueur fissure Longueur liaison Mesure longueur Modélisation Propagation fissure Signal vidéo Silicium Technique vidéo 0710C 8540H
- Keyword (en)
- Controlled atmosphere Static load Experimental study Theoretical study Crack Wafer bonding Relative humidity Interface Crack length Bond length Length measurement Modeling Crack propagation Video signal Silicon Video technique
- Keyword (es)
- Atmósfera controlada Carga estática Estudio experimental Estudio teórico Fisura Fijación pastilla Humedad relativa Interfase Largo fisura Longitud enlace Medición longitud Modelización Propagación fisura Señal video Silicio Técnica video
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B00 General / 001B00G Instruments, apparatus, components and techniques common to several branches of physics and astronomy / 001B00G10 Mechanical instruments, equipment and techniques / 001B00G10C Micromechanical devices and systems
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D12 Mechanical engineering. Machine design / 001D12I Precision engineering, watch making
- Discipline
- Electronics Mechanical engineering. Mechanical construction. Handling Metrology
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 27595568
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1007/s00542-012-1685-8 
https://dx.doi.org/10.1007/s00542-012-1685-8
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