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Stretchable copper interconnects with three-dimensional coiled structures

Author
CHAN WOO PARK1 ; SOON WON JUNG1 ; SANG CHUL LIM1 ; OH, Ji-Young1 ; BOCK SOON NA1 ; SANG SEOK LEE1 ; HYE YONG CHU1 ; JAE BON KOO1
[1] Next Generation Display Research Department, Electronics and Telecommunications Research Institute (ETRI), Daejeon 305-700, Korea, Republic of
Source

Journal of micromechanics and microengineering (Print). 2013, Vol 23, Num 12 ; 127002.1-127002.7 ; ref : 32 ref

ISSN
0960-1317
Scientific domain
Electronics; Mechanical engineering
Publisher
Institute of Physics, Bristol
Publication country
United Kingdom
Document type
Article
Language
English
Keyword (fr)
Bobine Charge cyclique Concentration contrainte Conductivité électrique Cuivre Dimensionnalité Dépôt électrolytique Etirabilité Interconnexion Résistance mécanique Siloxane(diméthyl) polymère
Keyword (en)
Coil Cyclic load Stress concentration Electrical conductivity Copper Dimensionality Electrodeposition Stretchability Interconnection Strength Dimethylsiloxane polymer
Keyword (es)
Bobina Carga cíclica Concentración restringida Conductividad eléctrica Cobre Dimensionalidad Depósito electrolítico Estirabilidad Interconexión Resistencia mecánica Siloxano(dimetil) polímero
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F01 Interfaces

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
28046534

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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