Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
- Author
- SIOW, Kim S1
[1] Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia - Source
Journal of electronic materials. 2014, Vol 43, Num 4, pp 947-961, 15 p ; ref : 126 ref
- CODEN
- JECMA5
- ISSN
- 0361-5235
- Scientific domain
- Crystallography; Electronics; Metallurgy, welding; Condensed state physics
- Publisher
- Springer, Heidelberg
- Publication country
- Germany
- Document type
- Article
- Language
- English
- Author keyword
- Sintered silver joint lead-free die-attach material low temperature joining technique nano-silver
- Keyword (fr)
- Argent Article synthèse Assemblage Conductivité thermique Conductivité électrique Epaisseur Equipement Fiabilité Frittage Inspection Matière charge Métallisation Nanomatériau Nanoparticule Packaging électronique Placage Rugosité Semiconducteur Stratifié Technique basse température Traitement matériau 8107 8540H 8540L
- Keyword (en)
- Silver Review Joining Thermal conductivity Electrical conductivity Thickness Equipment Reliability Sintering Inspection Filler Metallizing Nanostructured materials Nanoparticle Electronic packaging Plating Roughness Semiconductor materials Laminate Low-temperature techniques Material processing
- Keyword (es)
- Plata Artículo síntesis Ensamble Conductividad térmica Conductividad eléctrica Espesor Equipo Fiabilidad Sinterización Inspección Materia carga Metalización Nanopartícula Packaging electrónico Enchapado Rugosidad Semiconductor(material) Estratificado Tratamiento material
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A07 Nanoscale materials and structures: fabrication and characterization / 001B80A07Z Other topics in nanoscale materials and structures
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Discipline
- Electronics Physics and materials science
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 28580212
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1007/s11664-013-2967-3 
https://dx.doi.org/10.1007/s11664-013-2967-3
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