Influence of Structural Material and Epoxy Impregnation on Coil Strains in Y123 Pancake Coil
- Author
- TAKAO, T1 ; SAKAI, S1 ; ISHIZU, K1 ; NAKAYAMA, D1 ; NISHIMURA, K1 ; SAKAMOTO, O1 ; GOTO, T1 ; YAMANAKA, A2 ; FUKUI, S3 ; NISHIMURA, A4
[1] Faculty of Science and Technology, Sophia University, Tokyo 102-8554, Tokyo, Japan
[2] Toyobo Company Ltd., Ritto 520-3012, Japan
[3] Niigata University, Niigata 950-2181, Japan
[4] ITER Organization, 13115 Saint-Paul-Lez-Durance, France - Conference title
- THE TWENTY-THIRD INTERNATIONAL CONFERENCE ON MAGNET TECHNOLOGY, Boston, MA, USA, July 14-19 2013
- Conference name
- MT-23 International Conference on Magnet Technology (23 ; Boston, MA 2013-07-14)
- Source
IEEE transactions on applied superconductivity. 2014, Vol 24, Num 3 ; 8400205.1-8400205.5 ; ref : 10 ref
- ISSN
- 1051-8223
- Scientific domain
- Electronics; Electrical engineering
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Conference Paper
- Language
- English
- Author keyword
- Bobbin impregnation pancake coil thermal strain
- Keyword (fr)
- Bande supraconductrice Comportement thermique Dilatation thermique Déformation thermique Enroulement machine Etude expérimentale Gestion température packaging électronique Imprégnation Matériau composite Plastique renforcé fibre Propriété thermique Propriété thermomécanique Refroidissement Système refroidissement
- Keyword (en)
- Superconducting tapes Thermal behavior Thermal expansion Thermal strain Machine windings Experimental study Thermal management (packaging) Impregnation Composite material Fibre reinforced plastics Thermal properties Thermomechanical properties Cooling Cooling system
- Keyword (es)
- Comportamiento térmico Dilatación térmica Deformación térmica Estudio experimental Impregnación Material compuesto Plástico reforzado fibra Propiedad térmica Propriedad termomecánica Enfriamiento Sistema enfriamiento
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F11 Superconducting devices
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D05 Electrical engineering. Electrical power engineering / 001D05C Materials
- Discipline
- Electrical engineering. Electroenergetics Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 28688562
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1109/TASC.2013.2285709 
https://dx.doi.org/10.1109/TASC.2013.2285709
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