The mechanism of dealloying of copper solid solutions and intermetallic phases = Mécanisme de dégradation des solutions solides de cuivre et des phases intermétalliquesPRYOR, M. J; FISTER, J. C.Journal of the Electrochemical Society. 1984, Vol 131, Num 6, pp 1230-1235, issn 0013-4651Article

Copper-base foundry practice. Pt. 1:Standard designations for copper and copper alloys = Giessereipraxis im Umgang mit Cu-Basislegierungen. T. 1BRALOWER, P.M.Modern casting. 1986, Vol 76, Num 4, issn 0026-7562, 54Article

GEFUEGE UND EIGENSCHAFTEN DER LEGIERUNGEN V(NB)-AL(GA, SI, GE, SN)-CU = METALLOGRAPHIC STRUCTURE AND PROPERTIES OF V(NB)-AL(GA, SI, GE, SN)-CU ALLOYSSAVITSKY EM; JEFIMOV JU V; FROLOWA TM et al.1980; J. LESS-COMMON MET.; CHE; DA. 1980-12; VOL. 76; NO 1/2; PP. 81-98; BIBL. 41 REF.Article

Byzantine gold coins and jewellery:A study of gold contents = Byzantinische Goldmuenzen und SchmuckODDY, A; LA NIECE, S.Gold Bulletin. 1986, Vol 19, Num 1, pp 19-27, issn 0017-1557Article

Etude de la métallisation de substrats d'alumine et de nitrure d'aluminium par sérigraphie et liaison directe du conducteur cuivre. Application aux assemblages hybrides de puissance = Improvements of copper metallization of aluminum oxide and aluminum nitride substrates made by screen-printing and Direct Bonding Copper technologies. Application to hybrid power devicesMassiot, Pascal; Lucat, C; Zardini, C et al.1992, 176 p.Thesis

Correlation between erosion behaviour and stacking fault energy in copper alloys = Korrelation zwischen Erosionsverhalten und Stapelfehlerenergie in KupferlegierungenREDDY, A.V; SUNDARARAJAN, G; SIVAKUMAR, R et al.Acta metallurgica. 1984, Vol 32, Num 9, pp 1305-1316, issn 0001-6160Article

Mikro- und Makrogefuege von Kupferlegierungen und Anwendung von Erstarrungsdiagrammen = Microstructure and macrostructure of copper alloys and the use of solidification diagramsSCHETKY, L.M.D; BACKERUD, L; LILJENVALL, L.M et al.Giessereipraxis. 1984, Vol 4, pp 40-46, issn 0016-9781Conference Paper

Copper and copper alloys in Indian navyRAVICHANDER RAGHAVAN, I.N; RAO, P.B.1983, Vol 29, Num 4, pp 45-50, issn 0379-5446Article

TPR investigations on the reducibility of Cu supported on Al₂O₃, zeolite Y and SAPO-5DANG LANH HOANG; THI THUY HANH DANG; ENGELDINGER, Jana et al.Journal of solid state chemistry (Print). 2011, Vol 184, Num 8, pp 1915-1923, issn 0022-4596, 9 p.Article

Influence d'un micro-alliage sur le module d'élasticité du cuivreKRISHTAL, M. A; VYBOJSHCHIK, M. A; MERSON, D. L et al.Fizika metallov i metallovedenie. 1986, Vol 60, Num 4, pp 808-814, issn 0015-3230Article

ON THE ROLE OF SOLUTE ATOM - DISLOCATION ELASTIC INTERACTION IN SOLID SOLUTION HARDENING OF CU SINGLE CRYSTALSSMOLA B.1981; CZECH. J. PHYS., B; CSK; DA. 1981-04; VOL. 31; NO 4; PP. 447-452; BIBL. 25 REF.Article

Précipitation dans les alliages de cuivre dilués Cu-Fe-Ti, Cu-Co-Ti, Cu-Fe-Co-Ti = Precipitation in rich copper alloys Cu-Fe-Ti, Cu-Co-Ti, Cu-Fe-Co-TiMineau, Laurent; Callibert-Hamar, Thibault.1991, 233 p.Thesis

Electrical resistivity of ten selected binary alloy systems = Résistivité électrique de dix systèmes d'alliages binaires sélectionnésHO, C. Y; ACKERMAN, M. W; WU, K. Y et al.Journal of physical and chemical reference data. 1983, Vol 12, Num 2, pp 183-322, issn 0047-2689Article

VUV studies on the 4f partial states in lanthanide-copper compounds = Etudes VUV sur les états partiels 4f dans les composés lanthanide-cuivreISHII, T; SODA, K; KOMATSUBARA, T et al.Physica scripta (Print). 1987, Vol 35, Num 4, pp 603-608, issn 0031-8949Conference Paper

Diffusion dans les couches superficielles au cours du frottement des solidesRYBAKOVA, L. M; KUKSENOVA, L. I.Fizika i himiâ obrabotki materialov. 1983, Num 2, pp 119-125, issn 0015-3214Article

Frottement interne en température des alliages manganèse-cuivre trempés = Internal friction and temperature of quenched manganese-copper alloysZAARAOUI, Z; BOUQUET, G; DUBOIS, B et al.Journal de physique. Colloques. 1983, Vol 44, Num 9, pp 259-264, issn 0449-1947Article

Magnetic structures and related properties of some rare-earth intermetallic compounds, RCu₂ = Structures magnétiques et propriétés correspondantes de certains composés intermétalliques de lanthanides, RCu₂LEBECH, B; SMETANA, Z; SIMA, V et al.Journal of magnetism and magnetic materials. 1987, Vol 70, Num 1-3, pp 97-101, issn 0304-8853Conference Paper

The structure of Cu-Pb alloys obtained on a (111) single-crystal copper substrate = Structure d'alliages Cu-Pb obtenus sur un support monocristallin de cuivre(III)LAGIEWKA, E; BUDNIOK, A.Thin solid films. 1983, Vol 109, Num 3, pp 237-246, issn 0040-6090Article

ENTHALPY OF FORMATION AND EXCESS ENTROPY FOR DILUTE COPPER-BASED ALLOYS: EXPERIMENTAL AND THEORETICAL STUDYGACHON JC; NOTIN M; CUNAT C et al.1980; ACTA METALL.; USA; DA. 1980-04; VOL. 28; NO 4; PP. 489-497; BIBL. 43 REF.Article

HARDENING OF COPPER BY SOLID SOLUTION AND NEUTRON IRRADIATION = DURCISSEMENT DU CUIVRE PAR SOLUTION SOLIDE ET PAR IRRADIATION DE NEUTRONSMOHAMED HG; HAMMAD AM; HAMMAD FH et al.1982; TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS; ISSN 0019-493X; IND; DA. 1982; VOL. 35; NO 3; PP. 258-262; BIBL. 37 REF.Article

SHAPE MEMORY BEHAVIOUR = EFFET DE MEMOIRE MECANIQUEKENNON NF; DUNNE DP.1981; MET. FORUM; ISSN 0160-7952; USA; DA. 1981; VOL. 4; NO 3; PP. 130-134; BIBL. 10 REF.Article

Two-phase range and transition to nonselective meltingKUCHERENKO, E.S.Izvestiâ Akademii nauk SSSR. Metally. 1986, Vol 5, pp 92-96, issn 0568-5303Article

Forty years of investigation, research and technology development on copper base alloys at the physical metallurgy research laboratories (PMRL)SAHOO, M; EDWARDS, J.O; COUTURE, A et al.Canadian metallurgical quarterly. 1983, Vol 22, Num 2, pp 247-255, issn 0008-4433Article

Calcul de la résistance résiduelle des alliages de métaux précieuxSTEPANYUK, V. S; KATSNEL'SON, A. A; YASTREBOV, L. I et al.Metallofizika (Kiev). 1985, Vol 7, Num 4, pp 104-105, issn 0204-3580Article

Effect of 2,2'-dipyridyl on the plating rate, microstructure and performance of copper-coated tungsten composite powders prepared using electroless platingWENSHU CHEN; GUOQIANG LUO; MEIJUAN LI et al.Applied surface science. 2014, Vol 301, pp 85-90, issn 0169-4332, 6 p.Article