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The effect of a CNT interface on the thermal resistance of contacting surfacesSHAIKH, Shadab; LAFDI, Khalid; SILVERMAN, Edward et al.Carbon (New York, NY). 2007, Vol 45, Num 4, pp 695-703, issn 0008-6223, 9 p.Article

Thermal optimization of a construction of a double-heterostructure GaAs/(AlGa)As diode laserKORZENIOWSKI, A; NAKWASKI, W.Journal of thermal analysis. 1990, Vol 36, Num 3, pp 1039-1047, issn 0368-4466Article

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Thermal constriction resistance at the interface of double tubesWANG, J. C. Y; NOWAK, E. S.Journal of solar energy engineering. 1986, Vol 108, Num 1, pp 31-34, issn 0199-6231Article

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Calcul analytique exact de la resistance thermique de constriction due a des contacts elliptiques pour des valeurs de peclet variant de zero a l'infini = Analytical computation of the constriction thermal resistance due to elliptic contacts for Peclet values varying from zero to the infiniteLARAQI, Najib.Transferts thermiques lors du contact entre deux solides en mouvement relatif et leurs applications industrielles. Journée d'étude. 2000, 10 p.Conference Paper

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A GENERAL EXPRESSION FOR PREDICTING CONDUCTION SHAPE FACTORSYOVANOVICH MM.sdIN: AIAA 11TH. AEROSP. SCI. MEET.; WASHINGTON; 1973; NEW YORK; AM. INST. AERONAUT. ASTRONAUT.; DA. S.D.; VOL. 121; PP. 1-11; BIBL. 15 REF.Conference Paper

Optimierte Kühlung von Halbleitern. II: Auslegung von Kühlkörpern = Optimized cooling of semiconductorsHARS, D; SCHABACKER, T.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1995, Vol 103, Num 7-8, pp 402-403, issn 0944-1018Article

Spreading thermal resistance of the heat-sink of a light-emitting diodeNAKWASKI, W.Solid-state electronics. 1984, Vol 27, Num 8-9, pp 823-824, issn 0038-1101Article

Thermal resistance parameters for pathogens in white grape juice concentrateENACHE, Elena; YUHUAN CHEN; AWUAH, George et al.Journal of food protection. 2006, Vol 69, Num 3, pp 564-569, issn 0362-028X, 6 p.Article

Thermal insulation evaluation for a housing development project. DiscussionHAMMILL, J. L; FAROUK, B.ASHRAE transactions. 1985, Vol 91, Num 1, pp 240-254, issn 0001-2505Article

Evaluation de la stabilité thermique de pièces en matériaux céramiques fibreuxGORLOV, YU. P; KHARITONOVA, L. A; TRESKOVA, N. V et al.Steklo i keramika. 1985, Num 9, pp 20-21, issn 0131-9582Article

Thermal resistance of arbitrarily shaped contactsYOVANOVICH, M. M; THOMPSON, J. C; NEGUS, K. J et al.International conference on numerical methods in problems. 3. 1983, pp 1072-1082Conference Paper

Influence coefficient method for calculating discrete heat source temperature on finite convectively cooled substratesMUZYCHKA, Y. S.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004, isbn 0-7803-8357-5, Vol1, 394-402Conference Paper

Narrow channel forced air heat sinkGOLDBERG, N.IEEE transactions on components, hybrids, and manufacturing technology. 1984, Vol 7, Num 1, pp 154-159, issn 0148-6411Article

Action de l'eau sur la dégradation d'un revêtement émaillé pendant l'étude de sa thermostabilitéBEDNOSHEYA, V. YA; KOVAL, V. M; VYAL'TSEVA, N. YA et al.Steklo i keramika. 1984, Num 2, pp 17-18, issn 0131-9582Article