kw.\*:("Resistencia térmica")
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Thermal optimization of a construction of a double-heterostructure GaAs/(AlGa)As diode laserKORZENIOWSKI, A; NAKWASKI, W.Journal of thermal analysis. 1990, Vol 36, Num 3, pp 1039-1047, issn 0368-4466Article
Calcul analytique exact de la resistance thermique de constriction due a des contacts elliptiques pour des valeurs de peclet variant de zero a l'infini = Analytical computation of the constriction thermal resistance due to elliptic contacts for Peclet values varying from zero to the infiniteLARAQI, Najib.Transferts thermiques lors du contact entre deux solides en mouvement relatif et leurs applications industrielles. Journée d'étude. 2000, 10 p.Conference Paper
Thermal resistance parameters for pathogens in white grape juice concentrateENACHE, Elena; YUHUAN CHEN; AWUAH, George et al.Journal of food protection. 2006, Vol 69, Num 3, pp 564-569, issn 0362-028X, 6 p.Article
Influence coefficient method for calculating discrete heat source temperature on finite convectively cooled substratesMUZYCHKA, Y. S.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004, isbn 0-7803-8357-5, Vol1, 394-402Conference Paper
The longwave radiative heat transfer of the building envelopesNOWAK, H.Infrared physics. 1991, Vol 32, pp 357-363, issn 0020-0891Article
Determination of thermal contact resistances using the spectral functions of the boundary effectsTSAKANYAN, O. S.Inženerno-fizičeskij žurnal. 1990, Vol 58, Num 1, pp 135-140, issn 0021-0285, 6 p.Article
A new method to measure temperature- and power-dependent thermal resistance of HBTsMENOZZI, R; BARRETT, J; ERSLAND, P et al.ROCS workshop. 2004, pp 33-44, isbn 0-7908-0105-1, 1Vol, 12 p.Conference Paper
Evaluating thermal packaging concepts using thermal impedanceRIEMER, D. E.SPIE proceedings series. 1997, pp 437-442, isbn 0-930815-50-5Conference Paper
Tenue thermique : vers une gamme de BMC = Thermal behaviour: new BMC rangeWROTECKI, C; BAUCHET, F; OGINSKI, J.-C et al.Composites (Paris). 1992, Vol 32, Num 3, pp 411-416, issn 0754-0876Article
Glass fiberblanket SRM for thermal resistanceHUST, J. G.National Bureau of Standards Special Publication. 1985, issn 0083-1883, IX-16 p. [25 p.], 260-103Serial Issue
Wärmestromschalter für Kryoanwendungen = Heat flux switch for cryo applicationKAISER, G; BINNEBERG, A.KI. Luft- und Kältetechnik. 2000, Vol 36, Num 6, pp 278-281, issn 0945-0459Article
Increased Water Activity Reduces the Thermal Resistance of Salmonella enterica in Peanut ButterYINGSHU HE; YE LI; SALAZAR, Joelle K et al.Applied and environmental microbiology (Print). 2013, Vol 79, Num 15, pp 4763-4767, issn 0099-2240, 5 p.Article
Thermal interaction of an array of flip chip componentsJOINER, Bennett; DE OCA, Tony Montes.Annual IEEE semiconductor thermal measurement and management symposium. 2004, pp 286-291, isbn 0-7803-8363-X, 1Vol, 6 p.Conference Paper
Mica blindé = Shielded micaODILLE, Claude.1987, 17 p.Report
Normal zone propagation along superconducting films deposited on wide substratesSOKOLOVSKY, V; MEEROVICH, V.Cryogenics (Guildford). 2008, Vol 48, Num 9-10, pp 397-405, issn 0011-2275, 9 p.Article
Panneaux polyuréthanne pour toiture-terrasse = Polyurethane panels for flat roofsCahiers techniques du bâtiment. 1992, Num 140, issn 0241-6794, p. 69Article
Thermal resistance of Listeria spp. in milkBRADSHAW, J. G; PEELER, J. T; TWEDT, R. M et al.Journal of food protection. 1991, Vol 54, Num 1, pp 12-14, issn 0362-028X, 19 [4 p.]Article
Study of a macroscopic sliding contact thermal model from microscopic modelsCHANTRENNE, Patrice; RAYNAUD, Martin.International journal of thermal sciences. 2001, Vol 40, Num 7, pp 603-621, issn 1290-0729Article
Températures et résistance thermique de constriction dans les solides revêtus en contact glissant = Temperatures and thermal constriction resistance in coated solids in sliding contactLARAQI, N.Comptes rendus de l'Académie des sciences. Série II, Mécanique, physique, chimie, astronomie. 1997, Vol 324, Num 12, pp 739-746, issn 1251-8069Article
Influence of thermal contact resistance on thermal impedance of microelectronic structuresVERMEERSCH, B; DE MEY, G.Microelectronics and reliability. 2007, Vol 47, Num 8, pp 1233-1238, issn 0026-2714, 6 p.Article
Reducing thermal contact resistance using nanocoatingGOODARZI, Koorosh; SAYED REZA RAMEZANI; HAJATI, Shaaker et al.Applied thermal engineering. 2014, Vol 70, Num 1, pp 641-646, issn 1359-4311, 6 p.Article
Optimization for a heat exchanger couple based on the minimum thermal resistance principleLIN CHEN; QUN CHEN; ZHEN LI et al.International journal of heat and mass transfer. 2009, Vol 52, Num 21-22, pp 4778-4784, issn 0017-9310, 7 p.Article
Thermal Resistance of Francisella tularensis in Infant Formula and Fruit JuicesDAY, J. B; TRUJILLO, S; HAO, Y.-Y. D et al.Journal of food protection. 2008, Vol 71, Num 11, pp 2208-2212, issn 0362-028X, 5 p.Article
Modeling of thermal resistance dependence on design parameters in silicon-on-glass bipolar transistorsTAMIGI, F; NENADOVIC, N; D'ALESSANDRO, V et al.International conference on microelectronics. 2004, isbn 0-7803-8166-1, 2Vol, vol 1, 257-260Conference Paper
Self heating in InP DHBT technology for 40Gbit/s ICsABBOUN, M; ZEROUNIAN, N; DUBOIS, A et al.ESSCIRC 2002 : European solid-state circuits conferenceEuropean solid-state device research conference. 2002, pp 223-226, isbn 88-900847-8-2, 4 p.Conference Paper