16995314
Results 1 to 1 of 1
Selection :
Enhanced Cu/LCP adhesion by pre-sputter cleaning prior to Cu depositionHOWLADER, M. M. R; IWASHITA, M; NANBU, K et al.IEEE transactions on advanced packaging. 2005, Vol 28, Num 3, pp 495-502, issn 1521-3323, 8 p.Article