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High-Q above-IC inductors using thin-film wafer-level packaging technology demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNAXIAO SUN; DUPUIS, Olivier; LINTEN, Dimitri et al.IEEE transactions on advanced packaging. 2006, Vol 29, Num 4, pp 810-817, issn 1521-3323, 8 p.Article
