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Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang BonderCHEN, Ching-I; NI, Ching-Yu; CHANG, Chi-Min et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 4, pp 285-290, issn 1521-334X, 6 p.Article
