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Effect of the design and the tolerance parameters on the thermosonic transverse bonding flip chip systemHA KYU JUNG; WON TAE KWON; LEE, Soo-Il et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 6794, pp 67943B.1-67943B.6, issn 0277-786X, isbn 978-0-8194-6959-5, 2Vol, 2Conference Paper
