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Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip Interconnects : Wafer-level packagingWU, Wei-Cheng; CHANG, Edward Yi; HWANG, Ruey-Bing et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 2, pp 362-371, issn 1521-3323, 10 p.Article
