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Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding ProcessLIU, De-Shin; YEH, Shu-Shen; KAO, Chun-Teh et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 3, pp 593-601, issn 1521-3323, 9 p.Article
