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A novel method of hotspot temperature reduction for a 3D stacked CMOS IC chip device fabricated on an ultrathin substrateKATO, Fumiki; NAKAGAWA, Hiroshi; AOYAGI, Masahiro et al.Journal of micromechanics and microengineering (Print). 2013, Vol 23, Num 2, issn 0960-1317, 025020.1-025020.6Article
