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Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyondFIORI, Vincent; GALLOIS-GARREIGNOT, Sébastien; JAOUEN, Herve et al.Microelectronics and reliability. 2013, Vol 53, Num 2, pp 229-235, issn 0026-2714, 7 p.Article
