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The influence of silver content on structure and properties of Sn―Bi―Ag solder and Cu/solder/Cu jointsSEBO, P; SVEC, P; JANICKOVIC, D et al.SVEC, P; Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2013, Vol 571, pp 184-192, issn 0921-5093, 9 p.Article