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Factors affecting compressive stress produced in titanium nitride films deposited by reactive HCD ion plating

Author
MIURA, Kenichi1 ; ISHIGAMI, Itsuo1
[1] Technology Research Institute of Osaka Prefecture, Izumi 594-1157, Japan
Source

Nippon Kinzoku Gakkaishi (1952). = Journal of the Japan Institute of Metals (1952). 2001, Vol 65, Num 11, pp 981-986 ; ref : 19 ref

CODEN
NIKGAV
ISSN
0021-4876
Scientific domain
Metallurgy, welding
Publisher
Nippon Kinzoku Gakkai, Sendai
Publication country
Japan
Document type
Article
Language
Japanese
Keyword (fr)
Analyse contrainte Cathode creuse Contrainte compression Contrainte résiduelle Couche mince Etude expérimentale Grosseur grain Microscopie électronique balayage Placage ionique Titane nitrure
Keyword (en)
Stress analysis Hollow cathodes Compressive stress Residual stresses Thin films Experimental study Grain size Scanning electron microscopy Ion plating Titanium nitrides
Keyword (es)
Tensión compresión
Keyword (de)
Druckspannung
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H60 Physical properties of thin films, nonelectronic / 001B60H60B Mechanical and acoustical properties

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy

Pacs
6860B Mechanical and acoustical properties

Discipline
Metals. Metallurgy Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
13397393

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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