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Elastic moduli and hardness of cubic silicon nitride : Structure and properties of advanced nitrides and electronic nitrides

Author
ZERR, Andreas1 ; KEMPF, Markus2 ; SCHWARZ, Marcus1 ; KROKE, Edwin1 ; GÖKEN, Mathias2 ; RIEDEL, Ralf1
[1] FB Materialwissenschaft, Technische Universität Darmstadt, 64287 Darmstadt, Germany
[2] Universität des Saarlandes, FB 15 Werkstoffwissenschaften, 66041 Saarbrücken, Germany
Conference name
Structure and Properties of Advanced Nitrides and Electronic Nitrides. Symposium A4 (Indianapolis, IN 2001-04-22)
Source

Journal of the American Ceramic Society. 2002, Vol 85, Num 1, pp 86-90 ; ref : 36 ref

CODEN
JACTAW
ISSN
0002-7820
Scientific domain
Chemical industry parachemical industry
Publisher
Blackwell, Malden,MA
Publication country
United States
Document type
Conference Paper
Language
English
Keyword (fr)
Céramique sans oxyde Céramique thermomécanique Dureté Etude expérimentale Module élasticité Propriété mécanique Réseau cubique Silicium Nitrure Si3N4
Keyword (en)
Non oxide ceramics Structural ceramic Hardness Experimental study Elastic modulus Mechanical properties Cubic lattices Silicon Nitrides
Keyword (es)
Cerámica sin óxido Cerámica termomecánica Dureza Estudio experimental Módulo elasticidad Propiedad mecánica Silicio Nitruro
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D08 Chemical industry and chemicals / 001D08B Building materials. Ceramics. Glasses / 001D08B04 Ceramic industries / 001D08B04C Technical ceramics / 001D08B04C3 Structural ceramics

Discipline
Chemical and parachemical industries
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
13488875

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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