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DSC and FTIR analyses of the curing behavior of epoxy/dicy/solvent systems on hermetic specimens

Author
HONG, S.-G1 ; WU, C.-S1
[1] Department of Chemical Engineering, Yuan-Ze University, Nei-Li, Chung-Li 320, Taiwan, Province of China
Conference title
Brazilian Congress on Thermal Analysis and Calorimetry (CBRATEC)
Conference name
Brazilian Congress on Thermal Analysis and Calorimetry (CBRATEC) (CBRATEC) (1 ; Poços de Caldas, Minas Gerais 1998-03-29)
Author (monograph)
FERNANDES, Valter José (Editor)1
Brazilian Association for Thermal Analysis and Calorimetry (ABRATEC), Brazil (Funder/Sponsor)
[1] Research Department of the Federal University of Rio Grande do Norte, Natal, Brazil
Source

Journal of thermal analysis and calorimetry. 2000, Vol 59, Num 3, pp 711-719 ; ref : 33 ref

ISSN
1388-6150
Scientific domain
General chemistry, physical chemistry
Publisher
Springer, Dordrecht
Publication country
Netherlands
Document type
Conference Paper
Language
English
Keyword (fr)
Analyse thermique Calorimétrie différentielle balayage Durcissement(matière plastique) Effet milieu Effet solvant Epoxyde résine Spectrométrie IR Guanidine(2-cyano)
Keyword (en)
Thermal analysis Differential scanning calorimetry Curing(plastics) Medium effect Solvent effect Epoxy resin Infrared spectrometry
Keyword (es)
Análisis térmico Análisis calorimétrico barrido exploración Endurecimiento(material plástico) Efecto medio Efecto solvente Epóxido resina Espectrometría IR
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A05 Properties and testing / 001D10A05B Chemical properties

Discipline
Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
1355462

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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