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Hot embossing as a method for the fabrication of polymer high aspect ratio structures

Author
BECKER, H1 ; HEIM, U1
[1] Jenoptik Mikrotechnik, Goschwitzer Str 40, 07745 Jena, Germany
Source

Sensors and actuators. A, Physical. 2000, Vol 83, Num 1-3, pp 130-135 ; ref : 16 ref

ISSN
0924-4247
Scientific domain
Physics
Publisher
Elsevier Science, Lausanne
Publication country
Switzerland
Document type
Article
Language
English
Keyword (fr)
A chaud Dispositif micromécanique Dispositif électromécanique Etude expérimentale Fabrication microélectronique Gaufrage Microfluide Microstructure Rapport aspect Structure polymère
Keyword (en)
Hot process Micromechanical devices Electromechanical device Experimental study Microelectronic fabrication Embossing Microfluid Microstructure Aspect ratio Polymer structure
Keyword (es)
En caliente Dispositivo electromecánico Fabricación microeléctrica Gofrado Microfluido
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B00 General / 001B00G Instruments, apparatus, components and techniques common to several branches of physics and astronomy / 001B00G10 Mechanical instruments, equipment and techniques / 001B00G10C Micromechanical devices and systems

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing

Pacs
0710C Micromechanical devices and systems

Pacs
8540 Microelectronics: LSI, VLSI, ULSI; integrated circuit fabrication technology

Discipline
Electronics Metrology
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
1359842

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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