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Relationship between interaction of piled-up dislocations and strain induced boundary migration in pure aluminum bicrystals

Author
KASHIHARA, Keizo1 ; TANAKA, Hiroshi1 ; TAGAMI, Minoru2 ; OKADA, Tatsuya2 ; INOKO, Fukuji2
[1] Wakayama National College of Technology, 77 Noshima, Nada-cho, Gobo-shi, Wakayama 644-0023, Japan
[2] Faculty of Engineering, The University of Tokushima, Tokushima-shi, Tokushima, Japan
Source

Keikinzoku. = Journal of Japan Institute of Light Metals. 2002, Vol 52, Num 3, pp 101-107 ; ref : 34 ref

CODEN
KEIKA6
ISSN
0451-5994
Scientific domain
Metallurgy, welding
Publisher
Keikinzoku Gakkai, c/o Hibiya Asahi Seimeikan, Keikinzoku Kyokai, Tokyo
Publication country
Japan
Document type
Article
Language
Japanese
Keyword (fr)
Aluminium Bicristal Dislocation Déformation Migration joint grain Recristallisation Recuit
Keyword (en)
Aluminium Bicrystal Dislocation Deformation Grain boundary migration Recrystallization Annealing
Keyword (es)
Aluminio Bicristal Dislocación Deformación Migración limite grano Recristalización Recocido
Keyword (de)
Aluminium Bikristall Versetzung Verformung Korngrenzenwanderung Rekristallisation Gluehen
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A40 Treatment of materials and its effects on microstructure and properties / 001B80A40L Deformation, plasticity, and creep

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy

Discipline
Metals. Metallurgy Physics and materials science
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
13700453

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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