Simulation of thickness of electrodeposition coating
- Author
- OHARA, Katsuhiko1 ; YAGEZAWA, Kiyotaka2
[1] Central Research Lab., C. Uyemura & Co., Ltd., 1-5-1, Deguchi, Hirakata-shi, Osaka 573-0065, Japan
[2] Production Engineering Contorol Dept., Mitsubishi Motors Corporation, 1, Nakashinkiri, Hashime-cho, Okazaki-shi, Aichi 444-8501, Japan - Source
Hyomen gijutsu. = Journal of the Surface Finishing Society of Japan. 2002, Vol 53, Num 7, pp 480-484 ; ref : 5 ref
- ISSN
- 0915-1869
- Scientific domain
- Metallurgy, welding
- Publisher
- Hyomen Gijutsu Kyokai, Tokyo
- Publication country
- Japan
- Document type
- Article
- Language
- Japanese
- Keyword (fr)
- Couche mince Distribution courant Dépôt métal Dépôt électrolytique Epaisseur Etude théorique Méthode élément fini Revêtement Simulation numérique Simulation Epaisseur couche Revêtement métallique Traitement surface
- Keyword (en)
- Thin film Current distribution Metal deposition Electrodeposition Thickness Theoretical study Finite element method Coatings Numerical simulation Simulation
- Keyword (es)
- Capa fina Distribución corriente Deposición metal Depósito electrolítico Espesor Estudio teórico Método elemento finito Revestimiento Simulación numérica Simulación
- Keyword (de)
- Duennschicht Metallbeschichten Elektroplattieren Dicke Theoretische Untersuchung Finite Element Methode Ueberzug Simulation
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11C Production techniques / 001D11C06 Surface treatment / 001D11C06D Metallic coatings
- Discipline
- Metals. Metallurgy
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 13898658
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.4139/sfj.53.480 
https://dx.doi.org/10.4139/sfj.53.480
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