Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages
- Autor
- SHIAU, L. C1 ; HO, C. E1 ; KAO, C. R1
[1] Department of Chemical and Materials Engineering, National Central University, Chungli City, Taiwan, Province of China - Fuente
Soldering & surface mount technology. 2002, Vol 14, Num 3, pp 25-29 ; ref : 9 ref
- ISSN
- 0954-0911
- Campo Científico
- Electronics
- Editor
- Emerald, Bradford
- País de la publicación
- United Kingdom
- Tipo de documento
- Article
- Idioma
- English
- Palabra clave (fr)
- Alliage eutectique Analyse microsonde électronique Argent alliage Assemblage brasage tendre Brasage tendre Composé intermétallique Cuivre alliage Essai vieillissement Etain alliage Etude comparative Fabrication microélectronique Finissage surface Microscopie électronique balayage Montage surface composant Méthode essai Nickel alliage Or alliage Packaging électronique Plomb alliage Propriété matériau Protection environnement Résistance cisaillement Résultat expérimental Structure interface Technologie BGA Traitement surface (Au1-xNix)Sn4 Ag Cu Sn Au Ni Sn Sn-305Ag-0.75Cu brasage tendre sans plomb
- Palabra clave (in)
- Eutectic alloy Electron microprobe analysis Silver alloy Soldered joint Soldering Intermetallic compound Copper alloy Aging test Tin alloy Comparative study Microelectronic fabrication Surface finishing Scanning electron microscopy Surface mount technology Test method Nickel alloy Gold alloy Electronic packaging Lead alloy Properties of materials Environmental protection Shear strength Experimental result Interface structure BGA technology Surface treatment Lead-free soldering
- Palabra clave (es)
- Aleación eutéctica Analisis microsonda electronica Plata aleación Junta soldada Soldeo blando Compuesto intermetálico Cobre aleación Ensayo envejecimiento Estaño aleación Estudio comparativo Fabricación microeléctrica Microscopía electrónica barrido Montaje superficie componente Método ensayo Níquel aleación Oro aleación Packaging electrónico Plomo aleación Propiedad material Protección medio ambiente Resistencia cizallamiento Resultado experimental Estructura interfaz Tecnología BGA Tratamiento superficie
- Clasificación
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03D Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Disciplina
- Electronics
- Procedencia
- Inist-CNRS
- Base de datos
- PASCAL
- Identificador INIST
- 13946779
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1108/09540910210444692 
https://dx.doi.org/10.1108/09540910210444692
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