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An new instrument for measuring mechanical compliance of micro-systems

Author
JU, Bingfeng1 ; LIU, Kuo-Kang1 ; LING, Shih Fu1
[1] Center for Mechanics of Micro-systems (CMMs), School of Mechanical and Production Engineering, Nanyang Technological University, Singapore 639798, Singapore
Conference title
Experimental mechanics (Singapore, 29 November - 1 December 2000)
Conference name
International conference on experimental mechanics (2 ; Singapore 2000-11-29)
Author (monograph)
Fook Siong Chau (Editor); Chenggen Quan (Editor)
International Society for Optical Engineering, Bellingham WA, United States (Organiser of meeting)
Source

SPIE proceedings series. 2001, pp 252-255 ; ref : 7 ref

ISBN
0-8194-3998-3
Scientific domain
Electronics; Mechanics acoustics; Metrology and instrumentation; Optics; Physics; Telecommunications
Publisher
SPIE, Bellingham WA
Publication country
International
Document type
Conference Paper
Language
English
Keyword (fr)
Actionneur piézoélectrique Appareil mesure Caméra CCD Commande mouvement Courbe déformation Diagramme charge Etude expérimentale Mesure déformation Microscope optique Microstructure Propriété mécanique Saisie donnée Test conformité Traitement image
Keyword (en)
Piezoelectric actuators Measuring instruments CCD camera Motion control Deformation curve Load curve Experimental study Strain measurement Optical microscopes Microstructure Mechanical properties Data acquisition Compliance test Image processing
Keyword (es)
Cámara CCD Curva deformación Diagrama carga
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B00 General / 001B00G Instruments, apparatus, components and techniques common to several branches of physics and astronomy / 001B00G05 Computers in experimental physics / 001B00G05P Image processing

Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60B Mechanical and acoustical properties of condensed matter / 001B60B20 Mechanical properties of solids / 001B60B20F Deformation and plasticity (including yield, ductility, and superplasticity)

Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A70 Materials testing

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F21 Micro- and nanoelectromechanical devices (mems/nems)

Pacs
0705P Image processing

Pacs
6220F Deformation and plasticity (including yield, ductility, and superplasticity)

Pacs
8170 Methods of materials testing and analysis

Discipline
Electronics Metrology Physics and materials science Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
14044723

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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