Measuring toughness of copper-bismaleimide traizine interface by peel test
- Author
- GOH, N. Y1 ; CHENG, L1
[1] Department of Mechanical Engineering, National University of Singapore, Singapore 119260, Singapore - Conference title
- Experimental mechanics (Singapore, 29 November - 1 December 2000)
- Conference name
- International conference on experimental mechanics (2 ; Singapore 2000-11-29)
- Author (monograph)
- Fook Siong Chau (Editor); Chenggen Quan (Editor)
International Society for Optical Engineering, Bellingham WA, United States (Organiser of meeting) - Source
SPIE proceedings series. 2001, pp 280-285 ; ref : 3 ref
- ISBN
- 0-8194-3998-3
- Scientific domain
- Electronics; Mechanics acoustics; Metrology and instrumentation; Optics; Physics; Telecommunications
- Publisher
- SPIE, Bellingham WA
- Publication country
- International
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Bismaléimide résine Cuivre alliage Déformation élastique Energie rupture Essai pelage Etude expérimentale Fracture Milieu ambiant Méthode mesure Tension interfaciale Trempage
- Keyword (en)
- Bismaleimide resin Copper alloys Elastic deformation Fracture energy Peel test Experimental study Fractures Ambient medium Measuring methods Interfacial tension Soaking
- Keyword (es)
- Bismaleimida resina Energía ruptura Prueba al descascarado Medio ambiente Remojo
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60B Mechanical and acoustical properties of condensed matter / 001B60B20 Mechanical properties of solids / 001B60B20M Fatigue, brittleness, fracture, and cracks
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A70 Materials testing
- Discipline
- Physics and materials science Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 14044742
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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