The evaluation of different base materials for high density flip chip on flex applications
- Author
- PALM, Petteri1 ; MÄÄTTÄNEN, Jarmo1 ; PICAULT, Alain2 ; DE MAQUILLE, Yannick2
[1] Elcoteq Network Corporation, Helsinki, Finland
[2] FCI Microelectronics, Mantes la Jolie, France - Source
Microelectronics international. 2001, Vol 18, Num 3, pp 27-31 ; ref : 9 ref
- ISSN
- 1356-5362
- Scientific domain
- Electronics
- Publisher
- MCB University Press, Bradford
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Connexion épaissie Cycle thermique Essai hygrométrique Etude comparative Fiabilité Imide polymère Liaison matériau Matériau adhésif Matériau anisotrope Méthode essai Méthode mesure Packaging électronique Propriété matériau Résistance contact Résultat expérimental Sonde 4 pointes Structure flexible
- Keyword (en)
- Flip chip Thermal cycle Moisture test Comparative study Reliability Polyimide Bonding Adhesive material Anisotropic material Test method Measurement method Electronic packaging Properties of materials Contact resistance Experimental result Four point probe Flexible structure
- Keyword (es)
- Conexión espesada Ciclo térmico Prueba humedad Estudio comparativo Fiabilidad Imida polímero Material adhesivo Material anisótropo Método ensayo Método medida Packaging electrónico Propiedad material Resistencia contacto Resultado experimental Sonda 4 puntas Estructura flexible
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03B Testing, measurement, noise and reliability
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03D Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 14062008
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1108/13565360110405866 
https://dx.doi.org/10.1108/13565360110405866
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