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Locally selective bonding of silicon and glass with laser

Author
WILD, M. J1 ; GILLNER, A1 ; POPRAWE, R1
[1] Fraunhofer Institut fuer Lasertechnik, Steinbachstr. 15, 52074 Aachen, Germany
Source

Sensors and actuators. A, Physical. 2001, Vol 93, Num 1, pp 63-69 ; ref : 13 ref

ISSN
0924-4247
Scientific domain
Physics
Publisher
Elsevier Science, Lausanne
Publication country
Switzerland
Document type
Article
Language
English
Keyword (fr)
Dépendance température Etude expérimentale Fixation pastille Liaison matériau Mesure température Rayonnement laser Silicium Soudage laser Traitement par laser Verre SBL Selective bonding with laser
Keyword (en)
Temperature dependence Experimental study Wafer bonding Bonding Temperature measurement Laser radiation Silicon Laser welding Laser assisted processing Glass
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B00 General / 001B00G Instruments, apparatus, components and techniques common to several branches of physics and astronomy / 001B00G20 Thermal instruments, apparatus and techniques / 001B00G20D Thermometry

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)

Pacs
0720D Thermometry

Pacs
8540X Hybrid microelectronics; thick films

Discipline
Electronics Metrology
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
14090020

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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