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An abnormal strain rate effect on tensile behavior in nanocrystalline copper

Author
LU, L1 ; LI, S. X1 ; LU, K1
[1] Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Source

Scripta materialia. 2001, Vol 45, Num 10, pp 1163-1169 ; ref : 21 ref

ISSN
1359-6462
Scientific domain
Metallurgy, welding
Publisher
Elsevier Science, New York, NY
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Courbe rationnelle traction Cuivre Essai traction Etude expérimentale Nanomatériau Nanostructure Propriété mécanique Propriété traction Sensibilité vitesse déformation
Keyword (en)
True stress true strain curve Copper Tensile tests Experimental study Nanostructured materials Nanostructures Mechanical properties Tensile properties Strain rate sensitivity
Keyword (es)
Curva verdadera esfuerzo deformación Sensibilidad velocidad deformación
Keyword (de)
Wahre Spannungs Dehnungskurve Dehngeschwindigkeitsempfindlichkeit
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60B Mechanical and acoustical properties of condensed matter / 001B60B20 Mechanical properties of solids / 001B60B20F Deformation and plasticity (including yield, ductility, and superplasticity)

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy

Pacs
6220F Deformation and plasticity (including yield, ductility, and superplasticity)

Discipline
Metals. Metallurgy Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
14109094

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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