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The hardness and tribological property of the multilayered Cu/Ni-P coatings prepared by electrodeposition

Author
MIYAKE, Takeshi1 ; KUME, Michiyuki1 ; YAMAGUCHI, Koichi2 ; MINOURA, Hideki2
[1] Nagoya Municipal Industrial Research Institute 3-4-41, Rokuban, Atsuta-ku, Nagoya-shi, Aichi 456-0058, Gifu 501-1193, Japan
[2] Graduate School of Engineering, Gifu University, 1-1, Yanagido Gifu-shi, Gifu 501-1193, Japan
Source

Hyomen gijutsu. = Journal of the Surface Finishing Society of Japan. 2001, Vol 52, Num 9, pp 639-644 ; ref : 12 ref

ISSN
0915-1869
Scientific domain
Metallurgy, welding
Publisher
Hyomen Gijutsu Kyokai, Tokyo
Publication country
Japan
Document type
Article
Language
Japanese
Keyword (fr)
Alliage base nickel Cuivre Dureté Dépôt électrolytique Multicouche Phosphore alliage Revêtement multicouche Revêtement métallique Résistance usure Traitement surface Tribologie Alliage NiP Ni P Propriété mécanique
Keyword (en)
Nickel base alloys Copper Hardness Electrodeposition Multiple layer Phosphorus alloys Multilayer coating Metal coating Wear resistance Surface treatment Tribology Mechanical properties
Keyword (es)
Cobre Dureza Depósito electrolítico Capa múltiple Revestimiento multicapa Revestimiento metálico Resistencia al desgaste Tratamiento superficie Tribología Propiedad mecánica
Keyword (de)
Kupfer Haerte Elektroplattieren Mehrfachschicht Metallischer Ueberzug Verschleissfestigkeit Oberflaechenbehandlung Tribologie
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11C Production techniques / 001D11C06 Surface treatment / 001D11C06D Metallic coatings

Discipline
Metals. Metallurgy
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
14149334

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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