Reliability issues of ultra thin silicon nitride (a-SiN:H) by hot wire CVD for deep sub-micron CMOS technologies
Author
WAGHMARE, P. C1 ; PATIL, S. B1 ; KUMBHAR, A1 ; DUSANE, R. O1 ; RAMGOPAL RAO, V2
[1]
Department of Metallurgy and Material Science, Indian Institute of Technology, Bombay, Mumbai-400076, India
[2]
Department of Electrical Engineering, Indian Institute of Technology, Bombay, Mumbai-400076, India
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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