Microstructure and tensile properties of nanostructured Cu-25wt%Ag
- Author
- HAN, K1 ; VASQUEZ, A. A1 ; XIN, Y1 ; KALU, P. N1
[1] National High Magnetic Field Laboratory, Florida State University, 1800E Paul Dirac Drive, Tallahassee 32306, United States - Source
Acta materialia. 2003, Vol 51, Num 3, pp 767-780, 14 p ; ref : 23 ref
- ISSN
- 1359-6454
- Scientific domain
- Metallurgy, welding; Condensed state physics
- Publisher
- Elsevier Science, Oxford
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Author keyword
- Conductor Copper Nanostructure Phase transformation Silver
- Keyword (fr)
- Alliage base cuivre Alliage binaire Argent alliage Diffraction électron Essai traction Etude expérimentale Microscopie électronique transmission Microstructure Nanomatériau Nanostructure Texture Ag Cu Alliage Cu75Ag25
- Keyword (en)
- Copper base alloys Binary alloys Silver alloys Electron diffraction Tensile tests Experimental study Transmission electron microscopy Microstructure Nanostructured materials Nanostructures Texture
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A40 Treatment of materials and its effects on microstructure and properties / 001B80A40E Cold working, work hardening; annealing, quenching, tempering, recovery, and recrystallization; textures
- Pacs
- 8140E Cold working, work hardening; annealing, post-deformation annealing, quenching, tempering recovery, and crystallization
- Discipline
- Metals. Metallurgy Physics and materials science
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 14487111
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/S1359-6454(02)00468-8 
https://dx.doi.org/10.1016/S1359-6454(02)00468-8
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