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A study of polyamide-imide resin/copper foil composite materials

Author
SHEN CHOU1 ; LEE, Ker-Sen1
[1] Graduate School of Fibre and Polymer Engineering, National Taiwan University of Science and Technology 43, Keelung Road, Section 4, Taipei, 10672, Taiwan, Province of China
Source

Polymers & polymer composites. 2003, Vol 11, Num 1, pp 57-67, 11 p ; ref : 13 ref

ISSN
0967-3911
Scientific domain
Polymers, paint and wood industries
Publisher
Rapra Technology, Shrewsbury
Publication country
United Kingdom
Document type
Article
Language
English
Keyword (fr)
Adhésivité Amide polymère Amidoimide polymère Constante diélectrique Cuivre Etherimide polymère Etude expérimentale Matériau composite Polycondensation Polymère aromatique Résistance chaleur Résistance chimique Résistance pelage Stratifié Propriété surface Propriété électrique
Keyword (en)
Adhesivity Nylon Amidoimide polymer Permittivity Copper Etherimide polymer Experimental study Composite material Condensation polymerization Aromatic polymer Heat resistance Chemical resistance Peel strength Laminate Surface properties Electrical properties
Keyword (es)
Adhesividad Amida polímero Amidoimida polímero Constante dieléctrica Cobre Eterimida polímero Estudio experimental Material compuesto Policondensación Polímero aromático Resistencia calor Resistencia química Resistencia pelado Estratificado Propiedad superficie Propiedad eléctrica
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A06 Forms of application and semi-finished materials / 001D10A06I Laminates

Discipline
Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
14491384

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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