Method for measuring feature-scale planarization in copper chemical mechanical polishing processing
- Author
- LAURSEN, T1 ; RUNNELS, S. R2 ; BASAK, S1 ; GRIEF, M1 ; MURELLA, K1
[1] SpeedFam-IPEC, Chandler, Arizona 85226, United States
[2] Scott Runnels Consulting, Los Alamos, New Mexico 87544, United States - Source
Journal of the Electrochemical Society. 2003, Vol 150, Num 4, pp G279-G283 ; ref : 5 ref
- CODEN
- JESOAN
- ISSN
- 0013-4651
- Scientific domain
- General chemistry, physical chemistry; Crystallography; Electrical engineering; Condensed state physics
- Publisher
- Electrochemical Society, Pennington, NJ
- Publication country
- United States
- Document type
- Article
- Language
- English
- Keyword (fr)
- Couche mince métallique Cuivre Planarisation Polissage mécanochimique Traitement surface Métal transition
- Keyword (en)
- Metallic thin films Copper Planarization Chemical mechanical polishing Surface treatments Transition elements
- Keyword (es)
- Planarización
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A65 Surface treatments
- Discipline
- Physics and materials science
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 14711664
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1149/1.1556053 
https://dx.doi.org/10.1149/1.1556053
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