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Method for measuring feature-scale planarization in copper chemical mechanical polishing processing

Author
LAURSEN, T1 ; RUNNELS, S. R2 ; BASAK, S1 ; GRIEF, M1 ; MURELLA, K1
[1] SpeedFam-IPEC, Chandler, Arizona 85226, United States
[2] Scott Runnels Consulting, Los Alamos, New Mexico 87544, United States
Source

Journal of the Electrochemical Society. 2003, Vol 150, Num 4, pp G279-G283 ; ref : 5 ref

CODEN
JESOAN
ISSN
0013-4651
Scientific domain
General chemistry, physical chemistry; Crystallography; Electrical engineering; Condensed state physics
Publisher
Electrochemical Society, Pennington, NJ
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Couche mince métallique Cuivre Planarisation Polissage mécanochimique Traitement surface Métal transition
Keyword (en)
Metallic thin films Copper Planarization Chemical mechanical polishing Surface treatments Transition elements
Keyword (es)
Planarización
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A65 Surface treatments

Pacs
8165 Surface treatments

Discipline
Physics and materials science
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
14711664

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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