Ceramic interconnect technology : the next generation (Denver CO, 7-9 April 2003)
- Author
- International Microelectronics And Packaging Society, United States (Organiser of meeting)
Ceramic Interconnect Initiative (Organiser of meeting)
Amercian Ceramic Society, United States (Organiser of meeting)
International Society for Optical Engineering, Bellingham WA, United States (Organiser of meeting) - Conference name
- IMAPS conference on ceramic interconnect technology (Denver CO 2003-04-07)
- Source
SPIE proceedings series. 2003, 254 p. ; Illustration ; ref : dissem
- ISBN
- 0-8194-5105-3
- Scientific domain
- Electronics; Chemical industry parachemical industry; Optics; Physics; Telecommunications
- Publisher
- SPIE, Bellingham WA
- Publication country
- International
- Document type
- Conference Proceedings
- Language
- English
- Keyword (fr)
- Circuit intégré Encapsulation céramique Interconnexion
- Keyword (en)
- Integrated circuit Ceramic packaging Interconnection
- Keyword (es)
- Circuito integrado Encapsulación cerámica Interconexión
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 15302468
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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