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Continued study in power module substrates for automotive harsh environments

Author
EASIER, Keith1
[1] Kyocera America, Inc., 8611 Balboa Avenue, San Diego, CA 92123, United States
Conference title
Ceramic interconnect technology : the next generation (Denver CO, 7-9 April 2003)
Conference name
IMAPS conference on ceramic interconnect technology (Denver CO 2003-04-07)
Author (monograph)
International Microelectronics And Packaging Society, United States (Organiser of meeting)
Ceramic Interconnect Initiative (Organiser of meeting)
Amercian Ceramic Society, United States (Organiser of meeting)
International Society for Optical Engineering, Bellingham WA, United States (Organiser of meeting)
Source

SPIE proceedings series. 2003, pp 69-72, 4 p ; ref : 3 ref

ISBN
0-8194-5105-3
Scientific domain
Electronics; Chemical industry parachemical industry; Optics; Physics; Telecommunications
Publisher
SPIE, Bellingham WA
Publication country
International
Document type
Conference Paper
Language
English
Keyword (fr)
Caractéristique électrique Choc mécanique Circuit combinateur Combinateur puissance Comportement thermique Convertisseur alternatif continu Dispositif puissance Dissipateur thermique Dissipation thermique Electronique puissance Evaluation performance Grille transistor Industrie automobile Miniaturisation Onduleur Palier magnétique Produit nouveau Propriété thermique Système actif Transistor bipolaire grille isolée Vibration mécanique Convertisseur continu alternatif
Keyword (en)
Electrical characteristic Mechanical shock Combiner circuit Power combiners Thermal behavior Alternative continuous converter Power device Heat sink Thermal dissipation Power electronics Performance evaluation Transistor gate Automobile industry Miniaturization Inverter Magnetic bearing New product Thermal properties Active system Insulated gate bipolar transistor Vibrations (mechanical) DC AC converter
Keyword (es)
Característica eléctrica Choque mecánico Circuito combinador Comportamiento térmico Convertidor alternativo continuo Dispositivo potencia Disipador térmico Disipación térmica Electrónica potencia Evaluación prestación Rejilla transistor Industria automóvil Miniaturización Ondulador Cojinete magnético Producto nuevo Propiedad térmica Sistema activo Transistor bipolar rejilla aislada
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F05 Other multijunction devices. Power transistors. Thyristors

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
15302530

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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