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Preparation and characterization of modified-clay-reinforced and toughened epoxy-resin nanocomposites

Author
KAILIANG ZHANG1 ; LIXIN WANG2 ; FANG WANG3 ; GUANGJIAN WANG1 ; ZUOBANG LI2
[1] School of Information Engineering, Hebei University of Technology, Tianjin, 300130, China
[2] School of Chemical Engineering, Hebei University of Technology, Tianjin, 300130, China
[3] Department of Photoelectronics, Tianjin University of Technology, Tianjin, 300191, China
Source

Journal of applied polymer science. 2004, Vol 91, Num 4, pp 2649-2652, 4 p ; ref : 7 ref

CODEN
JAPNAB
ISSN
0021-8995
Scientific domain
Polymers, paint and wood industries
Publisher
Wiley, New York, NY
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Argile organique Epoxyde résine Matériau composite Nanocomposite Polymère réticulé Propriété dynamomécanique Propriété thermique Préparation Résistance choc Résistance traction Silicate lamellaire
Keyword (en)
Organic clay Epoxy resin Composite material Nanocomposite Crosslinked polymer Dynamic mechanical properties Thermal properties Preparation Impact strength Tensile strength
Keyword (es)
Arcilla orgánica Epóxido resina Material compuesto Nanocompuesto Polímero reticulado Propiedad dinamomecánica Propiedad térmica Preparación Resistencia choque Resistencia tracción
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D09 Physicochemistry of polymers

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers

Discipline
Physical chemistry of polymers Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
15595343

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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