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Synthesis and dielectric properties of polystyrene-clay nanocomposite materials

Author
WANG, Hong-Wen1 ; CHANG, Kung-Chin1 ; YEH, Jui-Ming1 ; LIOU, Shir-Joe1
[1] Department of Chemistry and Center for Nanotechnology at CYCU, Chung-Yuan Christian University, ChungLi 320, Taiwan, Province of China
Source

Journal of applied polymer science. 2004, Vol 91, Num 2, pp 1368-1373, 6 p ; ref : 21 ref

CODEN
JAPNAB
ISSN
0021-8995
Scientific domain
Polymers, paint and wood industries
Publisher
Wiley, New York, NY
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Agent surface cationique Argile Cristallinité Exfoliation Montmorillonite Nanocomposite Perte diélectrique Polymère Polymérisation radicalaire Propriété diélectrique Propriété thermique Préparation Styrène polymère Agent surface polymérisable
Keyword (en)
Cationic surfactant Clay Crystallinity Exfoliation Montmorillonite Nanocomposite Dielectric loss Polymer Free radical polymerization Dielectric properties Thermal properties Preparation Styrene polymer
Keyword (es)
Agente superficie catiónico Arcilla Cristalinidad Exfoliación Montmorilonita Nanocompuesto Pérdida dieléctrica Polímero Polimerización radicalar Propiedad dieléctrica Propiedad térmica Preparación Estireno polímero
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D09 Physicochemistry of polymers

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers

Discipline
Physical chemistry of polymers Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
15595674

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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