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Development of a new CuNiTiB brazing alloy for joining Si3N4 to Si3N4

Author
HUAPING XIONG1 ; CHUANGENG WAN1 ; ZHENFENG ZHOU1
[1] Welding Division, Department of Materials Science and Engineering, Jilin University of Technology, 130025 Changchun City, China
Source

Metallurgical and materials transactions. A, Physical metallurgy and materials science. 1998, Vol 29, Num 10, pp 2591-2596 ; ref : 11 ref

CODEN
MMTAEB
ISSN
1073-5623
Scientific domain
Crystallography; Metallurgy, welding; Condensed state physics
Publisher
Springer, New York, NY
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Alliage base cuivre Brasage Diffraction RX Etude expérimentale Microstructure Métallurgie soudage Produit apport brasage fort Propriété mécanique Silicium nitrure Soudure céramique céramique Soudure
Keyword (en)
Copper base alloys Brazing and soldering X ray diffraction Experimental study Microstructure Welding metallurgy Brazing filler Mechanical properties Silicon nitride Ceramic ceramic sealing Weld
Keyword (es)
Soldeo Difracción RX Estudio experimental Microestructura Metalurgia soldadura Producto aportación soldadura fuerte Propiedad mecánica Silicio nitruro Soldadura cerámica cerámica Soldadura
Keyword (de)
Loeten Roentgenbeugung Experimentelle Untersuchung Mikrogefuege Schweissmetallurgie Hartlot Siliciumnitrid Schweissnaht
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11D Joining, thermal cutting: metallurgical aspects / 001D11D02 Brazing. Soldering

Discipline
Metals. Metallurgy
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
1616711

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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